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Crucial has found a way to consolidate the needs of budget- and efficiency-oriented customer groups. Therefore, it developed a new series of SSDs, based on TLC memory. The BX200 2.5-inch drives (7 mm case depth) come equipped with 16-nm chips by Micron as well as Silicon Motion SM2256 controller. All the models share SATA III 6 Gb/sec interface and are compatible with Crucial Storage Executive & Acronis True Image HD utilities. Crucial BX200 are available in three capacity versions: 240 GB, 480 GB and 960 GB. Their maximal sequential Read/Write speed makes up 540/490 Mb/sec, whereas the maximal random Read/Write index achieves 66.000 & 78.000 IOPS correspondingly. As far as one can see, there is no visible decrease in performance, if compared with MLC memory showings.

The new-comers are estimated for 72 TB of data lifespan; this equals to 40 GB of daily loading over a span of 5 years (MTBF – 1.500.000 hours). In order to provide for the utmost reliability, Crucial adds a. Intel has officially introduced its new motherboard codenamed DX79SR. According to the company's developers, this board is the most functional one among all models ever released by Intel. One won't find it difficult to guess that the release of DX79SR is devoted to the announcement of a flagship processor Intel Core i7-3970X EE which breaks all records in terms of power-efficiency: its TDP level is estimated at 150W.

Motherboard Intel DX79SR is developed in ATX form-factor. It is compatible with LGA2011 socket and operates under Intel X79 Express chipset. The manufacturer alloted eight 240-contact slots for SDRAM memory of DDR3-2400+ type; the overall capacity of system memory might achieve 64 GB. Intel HD Audio is represented by 10-channel subsystem (7.1+2 channels with independent current transfer) with five analog outputs and optical S/PDIF output. Motherboard extension facilities include three slots for PCI-e 3.0 x16 expansion cards, a couple of PCI-e x1 slots, and a. Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans.

However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets. Cypress ez-usb driver. Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.